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30-11-2013, 23:55

ESI PAM-STAMP 2G 2012.2

Category: Software

ESI PAM-STAMP 2G 2012.2

ESI PAM-STAMP 2G 2012.2 | 1.2 Gb

ESI Group, pioneer and world-leading solution provider in virtual prototyping, announces the release of its PAM-STAMP 2G Version 2012.2. Dedicated to all engineers involved in the sheet metal forming process, PAM-STAMP 2G Version 2012.2 significantly shortens time to market by providing users with the results needed to make decisions at the right time : from an early stage of design right through to production.
PAM-STAMP 2G is a complete, integrated, scalable and streamlined stamping solution. It covers the entire tooling process from quotation and die design through formability and try-out validation, including springback prediction and correction. It provides solutions-oriented tools for Automotive, Aerospace, and General stamping processes.

PAM-STAMP 2G allows users to make decisions online, bringing together the design engineer, the material provider, the die designer and the try-out press shop from an early stage of the design right through to production. This web-enabled technology allows images, annotation, text and 3D, models to be shared, thus supporting a truly collaborative engineering environment.

About ESI Group

ESI is a pioneer and world-leading solution provider in virtual prototyping for manufacturing industries that takes into account the physics of materials. ESI has developed an extensive suite of coherent, industry-oriented applications to realistically simulate a product's behavior during testing, to fine-tune manufacturing processes in accordance with desired product performance, and to evaluate the environment's impact on performance. ESI's solutions fit into a single collaborative and open environment for End-to-End Virtual Prototyping, thus eliminating the need for physical prototypes during product development. The company employs about 850 high-level specialists worldwide covering more than 30 countries. ESI Group is listed in compartment C of NYSE Euronext Paris.












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