Cadence SPB OrCAD 16.50.047 Hotfix | 667 MB
Cadence Design Systems, Inc. announce hotfix version 047 for 16.50 release. This update includes some critical bug fixes.
New technologies in Allegro and OrCAD 16.5 include advanced miniaturization capabilities, integrated power delivery network analysis, DDR3 design-in kit, bolstered co-design featured and flexible team-design enablement to address global designer productivity.
A hot fix is a software maintenance package containing a small number of code fixes, designed to fix a small number of critical problems. A hot fix enables a customer to receive fixes for urgent problems, without having to wait for the next service pack.
Each successive Fix Pack is comprehensive and contains the material from the earlier Fix Packs for that Release, as well as all Interim Fixes made available since the previous Fix Pack or full Release. In other words, when multiple Fix Packs are available, you would not need to apply Fix Pack 1 before applying Fix Pack 2.
About Cadence Design Systems, Inc.
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry.
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